3D microelectronic packaging : from fundamentals to applications

Contributor(s): Li, Yan [Editor] | Goyal, Deepak [Editor]Language: English Series: Springer series in advanced microelectronics, 57Publication details: Cham Springer 2017Description: ix,463 p. 24 cmISBN: 978-3-319-44584-7Subject(s): Electrical Engineering | Microelectronic packaging | Integrated circuits | Three-dimensional microelectronic packaging
List(s) this item appears in: Display List 17/12/2018-23/12/2018
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Holdings
Item type Current library Call number Status Date due Barcode Item holds
Books Books Central Library, IITB
General Stacks 		621.372:621.382 Mic Checked out to Himanshu Sharma (23M1693) 15/05/2024 243224
Total holds: 0

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