3D microelectronic packaging : from fundamentals to applications
3D microelectronic packaging : from fundamentals to applications
- Cham Springer 2017
- ix,463 p. 24 cm
- Springer series in advanced microelectronics, 57 .
978-3-319-44584-7
Electrical Engineering
Microelectronic packaging
Integrated circuits
Three-dimensional microelectronic packaging
621.372:621.382 / Mic
978-3-319-44584-7
Electrical Engineering
Microelectronic packaging
Integrated circuits
Three-dimensional microelectronic packaging
621.372:621.382 / Mic