3D microelectronic packaging : from fundamentals to applications
Language: English Series: Springer series in advanced microelectronics, 57Publication details: Cham Springer 2017Description: ix,463 p. 24 cmISBN: 978-3-319-44584-7Subject(s): Electrical Engineering | Microelectronic packaging | Integrated circuits | Three-dimensional microelectronic packagingItem type | Current library | Call number | Status | Date due | Barcode | Item holds |
---|---|---|---|---|---|---|
Books | Central Library, IITB General Stacks | 621.372:621.382 Mic | Available | 243224 |
Total holds: 0
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