Interdiffusion and enhanced elastic modulus effect in composition modulated copper-nickel thin foils
Language: English Series: Publication details: Evanston ; Northwestern University, ; 1977Edition: Description: xii,185 p; 21 cmISBN: 0Subject(s): | Metallic films | Thermal diffusivity | Elasticity | Binary systems (Metallurgy) | Copper-nickel alloysItem type | Current library | Call number | Status | Notes | Date due | Barcode | Item holds |
---|---|---|---|---|---|---|---|
Books | Central Library, IITB | 669.017.3 Tsa | Available | C18B11 | 111655 |
Total holds: 0
There are no comments on this title.