Normal view MARC view ISBD view

Interdiffusion and enhanced elastic modulus effect in composition modulated copper-nickel thin foils

Tsakalakos, Thomas

Interdiffusion and enhanced elastic modulus effect in composition modulated copper-nickel thin foils - - Evanston Northwestern University, 1977 - xii,185 p. 21 cm - .

ISBN: 0

Subjects--Topical Terms:

Metallic films
Thermal diffusivity
Elasticity
Binary systems (Metallurgy)
Copper-nickel alloys

Universal Decimal Class. No.: 669.017.3 Tsa

Print
Add to your cart (remove)
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)