| 000 | 00712 a2200277 4500 | ||
|---|---|---|---|
| 001 | 67814 | ||
| 020 | _a0-471-30625-88 | ||
| 041 | _aeng | ||
| 080 | _a621.382:621.798 Pla | ||
| 245 | _aPlastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications / edited by Michael G. Pecht, Luu T. Nguyen and Edward B. Hakim | ||
| 250 | _a | ||
| 260 | _a | ||
| 260 | _bNew York : John Wiley, 1995 | ||
| 260 | _c1995 | ||
| 300 | _axxxiv,474 p. | ||
| 300 | _c24 cm | ||
| 490 | _a | ||
| 100 | _a | ||
| 700 | _a | ||
| 650 | _a | ||
| 650 | _aMicroelectronic packaging-Materials | ||
| 650 | _aMicroencapsulation | ||
| 650 | _aPlastics in packaging | ||
| 942 | _cBK | ||
| 942 | _2UDC | ||
| 999 |
_c50172 _d50172 |
||