| 000 | 00794 a2200253 4500 | ||
|---|---|---|---|
| 999 |
_c272061 _d272061 |
||
| 003 | OSt | ||
| 005 | 20210726190312.0 | ||
| 008 | 181206b xxu||||| |||| 00| 0 eng d | ||
| 020 | _a978-3-319-44584-7 | ||
| 040 | _cIITB | ||
| 041 | _aeng | ||
| 080 |
_a621.372:621.382 _bMic |
||
| 245 | _a3D microelectronic packaging : from fundamentals to applications | ||
| 260 |
_bSpringer _c2017 _aCham |
||
| 300 |
_aix,463 p. _c24 cm |
||
| 440 |
_aSpringer series in advanced microelectronics, 57 _93081 |
||
| 650 | 0 |
_aElectrical Engineering _926 |
|
| 650 |
_aMicroelectronic packaging _93075 |
||
| 650 |
_aIntegrated circuits _91100 |
||
| 650 |
_aThree-dimensional microelectronic packaging _93086 |
||
| 700 |
_aLi, Yan _eEditor _93076 |
||
| 700 |
_aGoyal, Deepak _eEditor _93077 |
||
| 942 |
_2udc _cBK |
||