| 000 | 00865 a2200265 4500 | ||
|---|---|---|---|
| 999 |
_c271955 _d271955 |
||
| 003 | OSt | ||
| 005 | 20210811112545.0 | ||
| 008 | 181120b xxu||||| |||| 00| 0 eng d | ||
| 020 | _a978-0-8155-1593-7 | ||
| 040 | _cIITB | ||
| 041 | _aeng | ||
| 080 |
_a621.382:539.23 _bSar |
||
| 100 |
_aSarkar, Jaydeep _92906 |
||
| 245 | _aSputtering materials for VLSI and thin film devices | ||
| 260 |
_bWilliam Andrew _c2013 _aWalthem |
||
| 300 |
_ax,603 p. _c24 cm |
||
| 650 | 0 |
_aElectrical Engineering _926 |
|
| 650 |
_aMicroelectronics _xMaterials _92907 |
||
| 650 |
_aCathode sputtering(Plating process) _xMaterials _92908 |
||
| 650 |
_aIntegrated circuits _xVery large scale integration _xMaterials _92909 |
||
| 650 |
_aThin film devices _xMaterials _92910 |
||
| 650 |
_aFlat panel displays _xMaterials _92911 |
||
| 650 | 0 |
_aSputtering(Physics) _92912 |
|
| 942 |
_2udc _cBK |
||