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Fundamentals of microsystems packaging

by Rao, R. Tummala | .

Series: Edition: Language: English Publication details: New York ; McGraw-Hill ; 2001Availability: Items available for loan: 1 Call number: 621.372:621.382Rao.
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Handbook of electronics packaging design and engineering (R)

by Matisoff, Bernard S | .

Series: Edition: 2nd ed Language: English Publication details: New York ; Van Nostrand Reinhold ; 1990Availability: Items available for loan: 1 Call number: 621.38(083)Mat(2).

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