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		Fundamentals of microsystems packaging by Rao, R. Tummala \| . Series: Edition: Language: English Publication details: New York ; McGraw-Hill ; 2001Availability: Items available for loan: 1 Call number: 621.372:621.382Rao. (1 votes) Place hold Add to cart (remove)
		Handbook of electronics packaging design and engineering (R) by Matisoff, Bernard S \| . Series: Edition: 2nd ed Language: English Publication details: New York ; Van Nostrand Reinhold ; 1990Availability: Items available for loan: 1 Call number: 621.38(083)Mat(2). Place hold Add to cart (remove)
		No cover image available Handbook of electronic packaging (R) by \| Harper, Charles A \| Harper, Charles A. Series: Edition: Language: English Publication details: New York ; McGraw Hill ; 1969Availability: Items available for loan: 1 Call number: 621.372:621.382(083)Han. Place hold Add to cart (remove)
		Handbook of electronic package design (R) by \| Pecht, Michael \| Pecht, Michael. Series: Mechanical EngineeringEdition: Language: English Publication details: New York ; Marcel Dekker ; 1991Availability: Items available for loan: 1 Call number: 621.38:621.798(083)Han. Place hold Add to cart (remove)

		Fundamentals of microsystems packaging by Rao, R. Tummala \| . Series: Edition: Language: English Publication details: New York ; McGraw-Hill ; 2001Availability: Items available for loan: 1 Call number: 621.372:621.382Rao. (1 votes) Place hold Add to cart (remove)
		Handbook of electronics packaging design and engineering (R) by Matisoff, Bernard S \| . Series: Edition: 2nd ed Language: English Publication details: New York ; Van Nostrand Reinhold ; 1990Availability: Items available for loan: 1 Call number: 621.38(083)Mat(2). Place hold Add to cart (remove)
		No cover image available Handbook of electronic packaging (R) by \| Harper, Charles A \| Harper, Charles A. Series: Edition: Language: English Publication details: New York ; McGraw Hill ; 1969Availability: Items available for loan: 1 Call number: 621.372:621.382(083)Han. Place hold Add to cart (remove)
		Handbook of electronic package design (R) by \| Pecht, Michael \| Pecht, Michael. Series: Mechanical EngineeringEdition: Language: English Publication details: New York ; Marcel Dekker ; 1991Availability: Items available for loan: 1 Call number: 621.38:621.798(083)Han. Place hold Add to cart (remove)

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