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Investigations on temperature distribution, stresses, and redistribution in silicon wafers during processing (R)

Das, J.K.

Investigations on temperature distribution, stresses, and redistribution in silicon wafers during processing (R) - Bombay IIT 1983 - xvi, 338 p. 28 cm

Thesis

Subjects--Topical Terms:
Silicon Devices

Universal Decimal Class. No.: 043:621.382 / Das

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